IEC 60749-39-2006 半导体器件.机械和气候试验方法.第39部分_半导体器件使用的有机材料的湿气扩散性和水溶解性的测量.pdf

标准号：IEC 60749-39-2006
实施状态：现行
中文名称：半导体器件.机械和气候试验方法.第39部分:半导体器件使用的有机材料的湿气扩散性和水溶解性的测量
英文名称：Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
发布日期：2006-07
代替标准：IEC 47/1860/FDIS-2006;IEC/PAS 62307-2002
采用标准：DIN EN 60749-39-2007,IDT;BS EN 60749-39-2006,IDT;EN 60749-39-2006,IDT;NF C96-022-39-2006,IDT;OEVE/OENORM EN 60749-39-2007,IDTN-EN 60749-39-2006,IDTN-EN 60749-39-2008,IDT
起草单位：IEC/TC 47
标准简介：This part of IEC 60749 details the procedures for the measurement of the characteristic
properties of moisture diffusivity and water solubility in organic materials used in the
packaging of semiconductor components.
These two material properties are important parameters for the effective reliability
performance of plastic packaged semiconductors after exposure to moisture and being
subjected to high-temperature solder reflow.
NOTE It is recommended that the moisture absorption parameters used in this standard be obtained from the
material suppliers (such as the resin supplier).
文件格式：PDF
文件大小：487.07KB
文件页数：28
（以上信息更新时间为：2019-11-25）



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