[国际电工委员会] IEC 60269-4-2006 低压熔断器.第4部分:半导体设备保护用熔断体的补充要求

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标准号:IEC 60269-4-2006
实施状态:作废
中文名称:低压熔断器.第4部分:半导体设备保护用熔断体的补充要求
英文名称:Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
发布日期:2006-11
被替代标准:IEC 60269-4-2009
代替标准:IEC 32B/471/CDV-2005;IEC 32B/485/FDIS-2006;IEC 60269-4-1986;IEC 60269-4 AMD 1-1995;IEC 60269-4 AMD 2-2002;IEC 60269-4 AMD 2 Corrigendum 1-2003;IEC 60269-4-1-2002
采用标准:DIN EN 60269-4-2008,IDT;BS EN 60269-4-2007,IDT;EN 60269-4-2007,IDT;NF C60-200-4-2007,IDT;OEVE/OENORM EN 60269-4-2008,IDT;GOST R IEC 60269-4-1-2007,IDT
起草单位:IEC/SC 32B
标准简介:These supplementary requirements apply to fuse-links for application in equipment containing
semiconductor devices for circuits of nominal voltages up to 1 000 V a.c. or 1 500 V d.c. and
also, in so far as they are applicable, for circuits of higher nominal voltages.
NOTE 1 Such fuse-Iinks are commonly referred to as “semiconductor fuse-links”.
NOTE 2 In most cases, a part of the associated equipment serves the purpose of a fuse-base. Owing to the great
variety of equipment, no general rules can be given; the suitability of the associated equipment to serve as a fusebase
should be subject to agreement between the manufacturer and the user. However, if separate fuse-bases or
fuse-holders are used, they should comply with the appropriate requirements of IEC 60269-1
文件格式:PDF
文件大小:899.61KB
文件页数:114
(以上信息更新时间为:2019-11-25)

IEC 60269-4-2006 低压熔断器.第4部分_半导体设备保护用熔断体的补充要求.pdf (899.61 KB)

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