标准号:IEC 60326-5-1980
实施状态:作废
中文名称:印制电路板 第5部分:具有金属化孔的单面和双面印制板规范
英文名称:Printed boards. Part 5 : Specification for single and double sided printed boards with plated-through holes
发布日期:1980
采用标准:DIN IEC 60326-5-1985,IDT;DIN IEC 60326-5-1993,IDT;BS 6221-5-1982,IDT;UNE 20621-5-1985,IDT;GOST R 50622-1993,IDT;DS/IEC 326-5(/DEK),IDT;NEN 10326-5-1981,IDT;SS-IEC 326-1985,MOD;SS-IEC 326-1991,MOD
起草单位:IEC/TC 91
标准简介:Contains fundamental information on characteristics to be assessed and requirements for single and double sided printed boards with plated-through holes. Is intended as a basis on which agreements between purchaser and vendor can be made. Defines the tes
文件格式:PDF
文件大小:4.31MB
文件页数:42
(以上信息更新时间为:2019-11-25)
IEC 60326-5-1980 印制电路板 第5部分_具有金属化孔的单面和双面印制板规范.pdf
(4.31 MB)
|
|